Supplier profile · 供应商档案

株式会社トップ精工 · TOP SEIKO Co., Ltd.

Contact 联系: info@top-seiko.co.jp · 0749-51-9021

简介（中文）

专注于难削材（陶瓷、高熔点金属、石英玻璃等）的精密加工与热扩散接合。提供形状加工、3D加工、精密/微细加工、多孔加工、深孔加工等服务。产品应用于半导体、航空航天、电子、汽车等领域。热扩散接合技术可实现原子级扩散接合，无需熔融。

Summary (English)

Specializes in precision machining of difficult-to-cut materials (ceramics, refractory metals, quartz glass) and thermal diffusion bonding. Offers shape machining, 3D machining, precision/micro machining, multi-hole drilling, deep-hole drilling. Serves semiconductor, aerospace, electronics, automotive industries. Thermal diffusion bonding enables atomic-level joining without melting.

注册信息 Registrations

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能力 Capabilities

工艺 Processes	CNC machining、precision machining、micro machining、3D machining、multi-hole drilling、deep-hole drilling、thermal diffusion bonding
材料 Materials	alumina (Al2O3)、aluminum nitride (AlN)、zirconia (ZrO2)、silicon carbide (SiC)、MMC (SiSiC)、silicon (Si)、machinable ceramics、molybdenum (Mo)、tungsten (W)、tantalum (Ta)、niobium (Nb)、nickel (Ni)、titanium (Ti)、quartz glass、sapphire (Al2O3)
服务区域 Regions	GLOBAL

Profile generated from public sources and the company's official website — verify key claims directly. 档案来自公开来源与企业官网，关键信息请直接核实。 Updated 更新: 2026-08-05

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