微精密技术（MPT）专注于厚膜混合微电路、陶瓷基板电路、半导体封装及混合组装，提供从设计到生产的定制服务。核心工艺包括厚膜印刷、SMT贴装、引线键合和芯片贴装，在10,000级洁净室中完成。材料方面主要使用氧化铝、氮化铝等陶瓷基板。已通过MIL-PRF-38534 Class H、AS9100D及ISO 9001:2015认证，并注册ITAR。服务于航空航天、国防、井下采矿、深海及太空等恶劣环境领域。
Summary (English)
Micro-Precision Technologies (MPT) specializes in thick film hybrid microcircuits, ceramic substrate circuits, semiconductor packaging, and hybrid assembly, offering custom design-to-production services. Key processes include thick film printing, SMT assembly, wire bonding, and die attach, performed in a class 10,000 cleanroom. Materials primarily involve ceramic substrates such as alumina, aluminum nitride, and beryllium oxide. Certified to MIL-PRF-38534 Class H, AS9100D, ISO 9001:2015, and ITAR registered. Serves harsh-environment applications including aerospace, defense, downhole mining, deep-sea, and space industries.
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能力 Capabilities
工艺 Processes
Thick film printing、Hybrid microcircuit assembly、Surface mount technology (SMT) assembly、Wire bonding (ball & wedge)、Die attach (manual & automated)、Semiconductor packaging (re-packaging, custom packages)、Reverse engineering、FR-4 to ceramic substrate conversion
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Updated 更新: 2026-09-15
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